Rakon推出了首款集成電路ROM1490X支持8小時(shí)延期
來源：http://m.py519.com 作者：億金電子 2024年05月22
Rakon推出了首款集成電路ROM1490X支持8小時(shí)延期
Rakon推出面向云數(shù)據(jù)中心和下一代電信網(wǎng)絡(luò)的小型IC-OCXO，支持8小時(shí)延期
隨著5G/5G Advanced和工業(yè)5.0的發(fā)展，以及無線接入網(wǎng)絡(luò)的開放，數(shù)據(jù)中心在新興網(wǎng)絡(luò)架構(gòu)中發(fā)揮著重要作用。
與傳統(tǒng)應(yīng)用程序不同，數(shù)據(jù)中心的新應(yīng)用程序有嚴(yán)格的同步要求。基于服務(wù)器的DU同步部署需要能夠承受數(shù)據(jù)中心惡劣環(huán)境的低功耗和小尺寸組件。
XMEMS支持的Rakon基于IC的頻率控制設(shè)備®基于的諧振器能夠抵御沖擊和振動(dòng)，并在小尺寸和低功耗下提供高穩(wěn)定性性能。
Rakon推出了首款集成電路OCXO晶體振蕩器產(chǎn)品，結(jié)合了其內(nèi)部設(shè)計(jì)的Mercury半導(dǎo)體芯片和XMEMS®MercuryX品牌的諧振器。MercuryX OCXOs提供了超高的穩(wěn)定性和8小時(shí)的延長保持時(shí)間。在現(xiàn)實(shí)條件下，所有器件都采用小尺寸封裝。新型OCXOs非常適合人工智能計(jì)算/數(shù)據(jù)中心、5G、5G Advanced和6G電信網(wǎng)絡(luò)以及衛(wèi)星終端和儀器儀表的計(jì)時(shí)和同步。
Rakon產(chǎn)品管理負(fù)責(zé)人Reza Sedehi表示:“MercuryX產(chǎn)品展示了XMEMS等下一代石英技術(shù)可能帶來的性能提升。首批1000多個(gè)MercuryX樣品引起了一級客戶的高度興趣和積極反饋。新產(chǎn)品建立在Rakon十多年來持續(xù)大批量提供基于高質(zhì)量ASIC的ocxo(IC-ocxo)的成功記錄之上。”
MercuryX之前推出了Niku，這是Rakon最新的內(nèi)部設(shè)計(jì)的ASIC半導(dǎo)體芯片，用于超穩(wěn)定的TCXO晶振，是該公司人工智能計(jì)算產(chǎn)品組合的下一款產(chǎn)品。
新的MercuryX OCXOs在穩(wěn)定性(1.5 ppb)、頻率斜率(0.05 ppb/°C)和老化(0.2 ppb/天)方面比當(dāng)前的IC-OCXO系列石英晶體振蕩器性能提高了三倍。更重要的是，MercuryX滿足了數(shù)據(jù)中心和高級電信網(wǎng)絡(luò)備受追捧的保持要求(8小時(shí))。
開發(fā)自己的內(nèi)部諧振器和芯片技術(shù)使Rakon能夠控制其產(chǎn)品路線圖，創(chuàng)造出像MercuryX這樣的市場領(lǐng)先產(chǎn)品，這些產(chǎn)品在其新西蘭和印度的工廠中獨(dú)立制造，為客戶提供高度安全的供應(yīng)。
該系列的首款產(chǎn)品是采用14x9mm封裝的ROM1490X，隨后將于2024年年中推出7x5mm產(chǎn)品。Rakon已經(jīng)在研究Mercury芯片的下一代產(chǎn)品，新的ASIC將于2025年發(fā)布，以進(jìn)一步提高性能。
Rakon推出了首款集成電路ROM1490X支持8小時(shí)延期
ROM1490X的主要性能參數(shù):
ROM1490X的主要性能參數(shù):
封裝:14.2x9.2x6.5毫米，6焊盤貼片晶振
頻率:10至50MHz
工作溫度:- 40至95攝氏度
頻率穩(wěn)定性（FvT）:1.5ppb
延期:8小時(shí)
頻率斜率（δF/δT）:0.05ppb/℃
老化:0.2ppb/天
重力敏感度:0.9ppb/g
定制的MercuryX產(chǎn)品通過先進(jìn)的I C總線數(shù)字控制、GNSS 1PPS輸入和/或機(jī)器學(xué)習(xí)進(jìn)一步優(yōu)化了長期穩(wěn)定性。
Rakon推出了首款集成電路ROM1490X支持8小時(shí)延期
Rakon launches Small Form Factor IC-OCXO with 8hr holdover for cloud data centres and next-generation telecom networks
我們的小尺寸OCXOs基于領(lǐng)先的專有Mercury和Mercury+技術(shù)。它們在整個(gè)溫度范圍內(nèi)具有出色的頻率穩(wěn)定性。MercuryX是Rakon的首款OCXO，采用了其專有的Mercury ASIC和XMEMS諧振器技術(shù)，增強(qiáng)了穩(wěn)定性和保持性能。例如，ROM1490X有源晶振在-40°C至+95°C溫度范圍內(nèi)實(shí)現(xiàn)了1.5ppb的頻率穩(wěn)定性，保持時(shí)間為8小時(shí)，頻率老化為0.2ppb/天。
這種高度集成的基于ASIC的OCXO設(shè)計(jì)具有最少的互連數(shù)量，從而顯著提高了可靠性，并因此降低了設(shè)備的總擁有成本(TCO)。
應(yīng)用程序:Data中心同步，5G基站和小型蜂窩、5G高級、6G無線接入網(wǎng)絡(luò)(RAN)、網(wǎng)絡(luò)定時(shí)、3E同步(IEEE1588，SyncE)、5G RRHs、光網(wǎng)絡(luò)和微波傳輸系統(tǒng)。
Rakon推出了首款集成電路ROM1490X支持8小時(shí)延期
Rakon launches Small Form Factor IC-OCXO with 8hr holdover for cloud data centres and next-generation telecom networks
Rakon has launched its first IC-OCXO products combining its in-house designed Mercury™ semiconductor chip and XMEMS® resonators under the brand MercuryX™. MercuryX OCXOs provide ultra-high stability and an extended holdover of 8 hours. in real-world conditions, all in a small form factor package size. The new OCXOs are an excellent fit for timing and synchronisation in AI computing / data centres and 5G, 5G Advanced and 6G telecommunications networks as well as satellite terminals and instrumentation.
Reza Sedehi, Head of Product Management at Rakon says: “The MercuryX products showcase the performance gains that are possible with next-generation quartz technology such as XMEMS. The initial 1000+ samples of MercuryX have generated high interest and positive feedback from tier-1 customers. The new products build on Rakon’s successful track record of consistently delivering high-quality ASIC based OCXOs (IC-OCXOs) in large volumes for over a decade.”
MercuryX follows the launch of Niku™, Rakon’s latest in-house designed ASIC semiconductor chip for Ultra Stable TCXOs, as the next entry in the company’s AI computing product portfolio.
The new MercuryX OCXOs offer a three-fold performance improvement on the current IC-OCXO range in terms of stability (±1.5 ppb), frequency slope (0.05 ppb/°C) and ageing (0.2 ppb/day). Even more importantly, MercuryX satisfies the much sought-after holdover requirements (8 hrs) for data centres and advanced telecom networks.
The development of its own in-house resonator and chip technology allows Rakon to control its product roadmap, creating market-leading products like MercuryX that are independently manufactured in its factories in New Zealand and India, providing customers with high security of supply.
The first product in the range is the ROM1490X in a 14 x 9 mm package, to be followed by a 7 x 5 mm product in mid 2024. Rakon is already working on the next iteration of the Mercury chip, with a new ASIC to be released in 2025 for further performance gains.
Rakon推出了首款集成電路ROM1490X支持8小時(shí)延期
Rakon推出了首款集成電路ROM1490X支持8小時(shí)延期
Key performance parameters of the ROM1490X:
Package: 14.2 x 9.2 x 6.5 mm, 6-pad, SMD
Frequency (Fn): 10 to 50 MHz
Operating temperature: - 40 to 95°C
Frequency stability (FvT): ±1.5 ppb
Holdover: 8 hrs
Frequency slope (ΔF/ΔT): 0.05 ppb/°C
Ageing: 0.2 ppb/day
G-sensitivity: 0.9 ppb/g
Custom MercuryX products with further optimised long-term stability through advanced I²C bus digital control, GNSS 1PPS input and/or machine learning are available on request.
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